4860P - Sn63/Pb37 Solder Paste - No-Clean

Description

Sn63/Pb37 solder paste, also known as Sn63 solder paste or 63 37 solder paste, is a no-clean solder paste that is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies.)

Sn63/pb37 solder paste is designed for use in high-speed printing and is an ideal choice for SMT solder paste printers. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.

Details and Specifications